Breaking News
Infineon collaborates with Qualcomm to enable high-quality standard solution for 3D authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
The reference design uses the REAL3™ 3D Time-of-Flight (ToF) sensor and enables a standardized, cost-effective and easy-to-design integration for smartphone manufacturers. Infineon has been successfully active with its 3D ToF sensor technology in the mobile device market for four years. Already at the CES 2020 in Las Vegas, the company has introduced the world’s smallest (4.4 mm x 5.1 mm) yet most powerful 3D image sensor with VGA resolution. It meets highest requirements for face authentication, enhanced photo features and authentic augmented reality experiences.
- EXCLUSIVE: “Passion Project” – Brice van de Walle, Mastercard in ‘The Fintech Magazine’ Read more
- FreedomPay Drives Global Merchant Innovation Read more
- FIS Brings AI-Powered Advancements to Seamless, Personalized Digital Banking Experiences Read more
- Citi Ventures Invests in BVNK to Power the Next Generation of Financial Infrastructure Read more
- Nearly Two-Thirds of Global Retailers Say Payment Method Flexibility Drives Revenue Growth, ACI Worldwide Survey Finds Read more